Products & solutions
Products & solutions
QS 200/QS 300 WET
SEMI-AUTOMATIC QUICKSTEP WET (QSW) TOOL FOR WET ETCHING, LIFT-OFF & CLEANING
Obducat’s highly successful QS 200/QS 300 WET platform provides the perfect solution for current and future R&D as well as pilot manufacturing requirements.
The platform flexibility enables the QS 200/QS 300 WET to cover a variety of applications such as LEDs, SiC components, 5G components, Si IC’s, MEMS, Opto-electronic, Photonic components and Advanced Packaging
Highlights
Suitable for R&D and pilot Manufacturing
High reliability and low Cost-of-Ownership
Highly configurable with a wide variety of options available
Process modules are the same as in HVM tools – enables easy migration to volume production
Customization possible for specific customer needs
Substrate size
| System | Substrate ⌀ |
|---|---|
| QSW 200 | 2” to 8” Ø or 2”x 2” to 6”x 6” |
| QSW 300 | 2” to 12” Ø or 2”x 2” to 9”x 9 |
Tool Configurations
The QS 200/QS 300 WET platform is highly configurable enabling a fit to almost any customer requirements while offering a superior cost efficiency. The tools are built in the materials compatible with the respective customer processes. There are dedicated standard configurations for Photomask Cleaning, Etching, Lift-off and general substrate Cleaning.
The tools are available as stand-alone tools which can be placed next to each other to create a mini-line of processing units.
This versatile tool can also process pieces from broken or damaged wafers. Manual loading and unloading of the substrates are very easy due to the unrestricted access into the process chamber.
For safety purposes an integrated and interlocked automatic process chamber door containing a safety interrupt sensor is standard. A fully automated dry-in, dry-out robot loading is optional
Operation control unit with color touch display and windows user interface
Unlimited process recipe / flow storage capacity plus USB port
Process parameter tracking
Ethernet port
Tool Options
Pirahna Clean
Application is delivered by an atomizer nozzle
Chemicals will be mixed in atomizer nozzle right at the point of use
Reaction temperature on wafer > 100°C
Chemicals are delivered from pressurized canisters
Recipe programmable sweep movement of dispense arm
Hot DI water rinse as an option
SC1 Clean
Application is delivered by an atomizer nozzle
Chemicals will be mixed in atomizer nozzle right at the point of dispense
Chemical flows for NH4OH, H2O2 and H2O are independently adjustable
Heated H2O line to obtain a working temperature of 60° to 70°C, upon special request 80°C
Chemicals are delivered from pressurized canisters
Recipe programmable sweep movement of dispense arm
SC2 Clean
Application is delivered by an atomizer nozzle
Chemicals will be mixed in atomizer nozzle right at the point of use
Chemical flows for HCl, H2O2 and H2O are independently adjustable
Heated H2O line to obtain a working temperature of 60° to 70°C, upon special request 80°C
Chemicals are delivered from pressurized canisters
Recipe programmable sweep movement of dispense arm
Solvent Clean
Application is delivered by a puddle or spray nozzle
Chemicals are delivered from pressurized canisters
Chemical flow adjustable via flowmeter
Recipe programmable sweep movement of dispense arm
Compatible to most solvents
Some solvents can be applied with high pressure (e.g. NMP, DMSO)
Mechanical cleaning
Brush scrubber – This uses rotating brushes and a pressing force. A special chuck design is used for front and backside scrubbing. A supplementary DI water line is used for rinsing. Smaller brushes are available for treating small pieces.
High pressure – For DI water or solvents. The recipe uses a programmable sweep movement of dispense arm. The pressure is adjustable from 10-180 bar. DI water can be re-ionized with CO2.
Megasonic nozzle – Energy transportation is done by DI water. The recipe uses a programmable sweep movement of dispense arm. The Megasonic can supply from 1 to 5MHz.
HF Clean / Etch
Application is delivered by a puddle nozzle
Chemicals are delivered from a pump (no pressurized canisters)
Chemical flow adjustable via flowmeter
Recipe programmable sweep movement of dispense arm
Metal / Si Etch
Application is delivered by a puddle or spray nozzle
Chemicals mixing via atomizer nozzles or static mixer
Chemical supply either via pressurized canisters or via pumps
Chemical flow adjustable via flowmeter
Recipe programmable sweep movement of dispense arm
Compatible with most acids and caustic mixtures
Extended Hot Plate temperature – up to 450°C
The extended high temperature hot plates are implemented to meet the requirements needed in processes such as:
Reflow
Pyrolysis
Final hard bake of protection layers
Temperature controlled chemical lines
When chemicals are supplied from the wafer fab or stored outside the cleanroom the temperatures are different to the cleanroom environment causing chemicals to react and perform differently with changes in temperature. This can result in processing variations. This option can ensure a repeatable temperature level of the chemical’s substrate-to-substrate at point of dispense.
Multiple Chuck solutions – Low contact, Bernoulli Chuck solutions for etching & cleaning:
Standard wafers that are wet treated use low contact chucks, where the wafer is held in place by supporting pins. and centripetal force fixing it during the high-speed drying.
Squared substrates are held at the corners by alignment pins using low contact chucks. The advantage of this chuck is the entire backside can be rinsed.
If the backside must be protected against aggressive (etching) medias, a Bernoulli chuck can be used. This chuck blows nitrogen which protects the entire backside against chemicals. Alignment pins hold the wafer in place and enables high spin acceleration.
If alignment pins are not allowed, a venturi chuck can be used instead. Nitrogen is injected into the chuck, creating a vacuum in the chuck center by mean of an integrated Venturi nozzle. The nitrogen blows out close to the wafer backside edges. This also protects the wafer backside against chemicals.
Automatic substrate Load/unload
A fully automated dry-in, dry-out substrate load/unload system can be incorporated into the tool.
Connection to wafer fab Manufacturing Execution Systems
The tool can be configured to enable connection to various Manufacturing Execution System (MES) interfaces such as:
SECS / GEM
OPC/UA
Customer specific interfaces